Cheerleading Fundraisers for Middle School?

Have a bake sale or a snack bar stand (soda, chips, water, etc) at different community events such as street fairs, carnivals, etc

1. Cooking Party--what would you make?--?

ummmmm u could make personal pizzas u could make cupcakes u could crack green bans to put in a cassorelle ooooh u could make smmothies or milkshakes u could churn some ice crem in a barrel ooooh u could chop up all sorts of vegatables and boil some water and toss the vegatables in for a hearty soup u could make a toss salad u could slice some potatoes real thin and then boil them to make chips u could make a bean dip or a salsa for the chips

2. Will I survive without a car in Vancouver?

You will manage fine without a car, especially where you will be staying which is close to bus routes. Lynn Canyon was a good suggestion as was Science World. Go to Lynn Canyon via the Seabus which crosses the harbour so you get a boat ride as part of your bus fare. You could grab a bus out to Horseshoe Bay to have fish and chips at Troll's or ice cream at Baskin Robbins and watch the ferries come and go, and there's a small park there with playground stuff in it. To get there, take the bus that goes out along Marine Drive in West Vancouver(# 259, leaves from downtown along Georgia St) and you can goggle at the million dollar homes along the way, it's a pretty drive. In summer it could pass for the south of France. Sit on the left on the way out for the water views. The Planetarium(actually, it's the H. R. MacMillan Space Centre) has some very cool shows at all times of day. You can get the bus to Grouse Mountain too, which has a skytram, always exciting, incredible views if it's not raining. It's likely to be dry, August does not usually see much rain.

3. what is good about homemade body scrub?

Nonsense. For example, Lush make body scrubs out of sea salt (large grains) and oils and some essential oils. It's perfectly fine to make your own scrub. I make mine like this: 1 cup of brown sugar (white will work just as well but the granules are slightly bigger in brown) 3 tablespoons of olive oil Optional: 10 drops of my favourite essential oil (do not use a citrus one like lemon, it can sting) I mix this into a paste in a bowl and then take it into the bathroom with me. I use sugar instead of salt because salt can sting any open cuts or it can sting your legs if you've shaved them recently. Look online for different recipes, it's so much fun making your own scrubs and mask and they are MUCH better - no chemicals, no crap, CHEAP as chips, and tailor-made for you. Enjoy!

4. PARTY PLANNING!! How much food for around 50 teenagers???

If you do root beer floats they will really fill people up :) Also I saw a fun Halloween cake at Is it for boys and girls? If your friends are big eaters delivery pizza: 10 pizzas root beer: 10-15 liter bottles, less if serving with ice cream 4 gallons vanilla ice cream if desired 6 bags of chips big cake double the cake listed above( so do 4 sheet cakes instead of 2) Have extra candy on the side to add to the cake; extra gummy worms especially! also maybe some m&m's and crushed cookies on the side.

5. What to give to a deploying soldier?

I do not know if he's religious or not, but they are allowed to wear a religious charm on their dog tags. When I was deployed peanuts(nuts in general), gum and favorite kind of chips seemed popular

6. Qualcomm's Quad-core Chips to Counter Intel's Ultrabooks

Qualcomm is preparing a quad-core version of its Snapdragon S4 chip for thin and light Windows 8 laptops, which the chip maker hopes will steal some thunder from Intel's second wave of ultrabooks due later this year. The S4 chips will go into laptops that are thinner and lighter than Apple's MacBook Air or today's ultrabooks, according to Rob Chandhok, senior vice president at Qualcomm. Ultrabooks are being promoted by Intel as a new category of thin and light laptops. "We think much lighter than what Intel calls an ultrabook," Chandhok said. The lines between high-end smartphones, where Qualcomm's chips are normally found, and laptops has started to blur, Chandhok said. The S4 chips will enable smaller laptops with high-resolution screens, longer battery life and always-on connectivity, he said. The chips are based on a core from U.K. chip design company ARM, and include an integrated modem and a graphics core capable of handling 3D graphics. Just as Intel hopes to make microprocessors for smartphones, Qualcomm is trying to expand out of the smartphone market and into PCs. It has already shipped some prototype Windows 8 PCs with Snapdragon chips to developers. But Intel is moving against the ARM-based vendors by pouring millions of dollars into developing ultrabooks. Qualcomm hopes Snapdragon laptops will be differentiated by their 4G connectivity and strong multimedia qualities, Chandhok said. The S4 will be manufactured with a 28-nanometer process, improving power efficiency and performance compared to earlier Snapdragon chips, Chandhok said. While ARM chips often provide longer battery life, they generally pack less performance than Intel's Core processors. Qualcomm is also thinking about 64-bit support on Snapdragon, but Chandhok could not reveal when such a chip would be released. Windows 8 will be a 64-bit OS, and ARM has already announced 64-bit support with its upcoming ARMv8 architecture. Having a powerful Snapdragon chip with four CPU cores and multiple graphics cores will make a difference for Windows 8 devices, especially for applications like games, Chandhok said. Windows 8 can improve application performance by executing programs in parallel across multiple cores, and Qualcomm is working on compilers to parallelize program execution for everyday applications like browsers. "There will be maturation on the software," Chandhok said. Aside from makers of x86 chips, Qualcomm will compete with ARM-based chip makers Nvidia and Texas Instruments, which are also supplying chips for Windows 8 tablets. While many basic features will be similar, Qualcomm will try to differentiate its chips by developing software that plays to unique multimedia and cellular connectivity features on Snapdragon. "In this day and age, the instruction set matters," Chandhok said. Agam Shah covers PCs, tablets, servers, chips and semiconductors for IDG News Service. Agam's e-mail address is

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H.p. Reports Big Advance in Memory Chip Design
H.p. Reports Big Advance in Memory Chip Design
By JOHN MARKOFFMAY 1, 2008Hewlett-Packard scientists reported Wednesday in the science journal Nature that they have designed a simple circuit element that they believe will make it possible to build tiny powerful computers that could imitate biological functions.The device, called a memristor, would be used to build extremely dense computer memory chips that use far less power than today’s DRAM memory chips. Manufacturers of today’s chips are rapidly reaching the limit on how much smaller chips can be.The memristor, an electrical resistor with memory properties, may also make it possible to fashion advanced logic circuits, a class of reprogrammable chips known as field programmable gate arrays, that are widely used for rapid prototyping of new circuits and for custom-made chips that need to be manufactured quickly.Potentially even more tantalizing is the ability of the memristors to store and retrieve a vast array of intermediate values, not just the binary 1s and 0s conventional chips use. This allows them to function like biological synapses and makes them ideal for many artificial intelligence applications ranging from machine vision to understanding speech.AdvertisementIndependent researchers said that it seemed likely that the memristor might relatively quickly be applied in computer memories, but that other applications could be more challenging. Typically, technology advances are not adopted unless they offer large advantages in cost or performance over the technologies they are replacing.Advertisement“Whether it will be useful for other large-scale applications is unclear at this point,” said Wolfgang Porod, director of the Center for Nano Science and Technology at the University of Notre Dame.The technology should be fairly quickly commercialized, said R. Stanley Williams, director of the quantum science research group at Hewlett-Packard. “This is on a fast track.”The memristor was predicted in 1971 by Leon Chua, an electrical engineer at the University of California, Berkeley. There have been hints of an unexplained behavior in the literature for some time, Mr. Chua said in a phone interview on Tuesday.He noted, however, that he had not worked on his idea for several decades and that he was taken by surprise when he was contacted by the Hewlett-Packard researchers several months ago. The advance clearly points the way to a prediction made in 1959 by the physicist Richard Feynman that “there’s plenty of room at the bottom,” referring to the possibility of building atomic-scale systems.“I can see all kinds of new technologies, and I’m thrilled,” he said.The original theoretical work done by Mr. Chua was laid out in a paper, “Memristor — The Missing Circuit Element.” The paper argued that basic electronic theory required that in addition to the three basic circuit elements — resistors, capacitors and inductors — a fourth element should exist.Please verify you're not a robot by clicking the box.Invalid email address. Please re-enter.You must select a newsletter to subscribe to.View all New York Times newsletters.The Hewlett-Packard research team titled their paper, “The Missing Memristor Found.”The Hewlett-Packard researchers said that the discovery of the memory properties in tiny, extremely thin spots of titanium dioxide came from a frustrating decade-long hunt for a new class of organic molecules to serve as nano-sized switches. Researchers in both industry and academia have hoped they would be able to fashion switches as small as the size of a single molecule to someday replace transistors once the semiconductor industry’s shrinking of electronic circuits made with photolithographic techniques reached a technological limit.The memristor is a radically different approach from another type of solid state storage called phase-change memory that is being pursued by I.B.M., Intel and other companies. In phase-change memory, heat is used to shift a glassy material from an amorphous to a crystalline state and back again. The switching speed of these systems is both slower and requires more power, according to the Hewlett-Packard scientists.The Hewlett-Packard team has successfully created working circuits based on memristors that are as small as 15 nanometers (the diameter of an atom is roughly about a tenth of a nanometer.) Ultimately, it will be possible to make memristors as small as about four nanometers, Mr. Williams said. In contrast the smallest components in today’s semiconductors are 45 nanometers, and the industry currently does not see a way to shrink those devices below about 20 nanometers.Because the concept of a memristor was developed almost 40 years ago by Mr. Chua, it is in the public domain. The Hewlett-Packard scientists, however, have applied for patents covering their working version of the device.AdvertisementThe most significant limitation that the Hewlett-Packard researchers said the new technology faces is that the memristors function at about one-tenth the speed of today’s DRAM memory cells. They can be made in the same kinds of semiconductor factories that the chip industry now uses, however.A version of this article appears in print on , on Page C4 of the New York edition with the headline: . Order Reprints| Today's Paper|SubscribeWe’re interested in your feedback on this page. Tell us what you think.
How Can I Get Ripped Really FAST?
How Can I Get Ripped Really FAST?
When out at a restaurant, ask the server to hold the bread, snack mix or chips and salsa that may come before the meal. Should you be hungry, you will be tempted1. What are some healthy snacks, dinners, meals that are yummy but simple?Snacks: carrots with ranch, humus with chips, or just a Apple Smoothies; banana strawberry And this is a drink/snack it sounds weird but try it; slice up an apple into small pieces, get a glass of water and put ice in it, then put the apples in the water and drink it/ eat it2. What is the best way to gain weight?all you need to do is eat eat and eat sweets like candy cake pizza etc. its ok if you eat chips but not too much then drink water you can eat rice too or sandwich3. GIRLS! How do you get motivated to loose weight!?im always on the couch! and try so hard to get motivated whats makes me get up and workout is thinking that summer will be here soon and the more i work out now during winter the better i will look by summer i also watch the music chan on foxtell a lot so you can see how skinny and fit the girls look in the music videos and it makes me think, man i want to look like that by summer or now! so i work out while i watch the music channel :) when im un motivated or less motivated, instead of eating chips i dont buy them any more i just eat dry fruit and drink juice and water, so much better makes me feel better to this way i dont put all the weight i worked out back on again ;)4. Can you substitute bittersweet chocolate chips for semisweet chocolate chips?This Site Might Help You. RE: Can you substitute bittersweet chocolate chips for semisweet chocolate chips? Im making a cake and I just found out we don't have semisweet chocolate chips. Can I use bittersweet chocolate chips instead?5. Oreos or Chips Ahoy??? =]?Chips Ahoy (:6. Megapixels Or Sensor Size ?Digital camera sensors are expensive to make, have you noticed the price of the camera or backs from the companies you listed..?! Pixel density is the more important issue these days because even the APS-C size chips can produce amazing images and sizes. Especially Fuji's new line of chips. they have a good article there. Google it too.... However, chips are still like film, kinda, in the way of larger is better, (unless we pack even MORE pixels on the same size chip) but we have physical problems here of light illuminating all 4 corners evenly and getting into the "wells" the chips have. Chips are NOT flat but have microscopic pits or wells that have to be illuminated into and because the nature of light as it exits the rear element of your lens is in a cone shaped pattern, light is hitting the corners at a slight angle and casting shadows or lower illumination there. There ARE backs for medium and large format cameras, but few are full frame as 35mm is. Regardless of the format size, 35mm, 6x6, 4x5.. the probs are the same, the cone of light. A curved sensor has been discussed but this would be optimal for few lenses and a way to make a flexible chip to match the cone of influence each and every lens gives would be a monumental feat in micro/macro technology with micro cams and actuators. My Fuji S-2 and S-5 can produce images that even my 3Ghz AMD 6000 64bit X2 chip with a FSB buss mobo of 2khz and 3Gb ram choke on and can bog down when doing full rez work. RAW is even worse. Imagine the megabyte size files these camera you mention could make and how many computers would just die trying to eat that let alone actually do much with them, in a timely fashion. Many camera companies WANT you to feel insecure with your last purchase and buy new again. My Fuji's are 6.2 /- Mp but the super Fuji chip DOES have 12Mp on it. I can make 16x20's that look good. Real good, and have gone as far as 24x36 on my Epson 7600 printer using Qimage that at a normal viewing distance of 3 ft, look as good as 400 35mm film. To take a APS-C size chip and make it a real 12 or 15Mp with the same technology Fuji is doing, with a 2nd sensor next to the larger 1st one (now bring the actual count to 24 or 30Mp) would be short or actually exceed - awesome...! But to also pack that into a 1.5x1.5 or so square chip for a med format camera.. Man, what DR and resolution. So, in regards to your question, again - Mega pixels Or Sensor Size ? I would have to say it is a hand in hand marriage but packing more pixels on to chips we have now, pixel density, is a way to go... Bob - Tucson
How to Develop Mainstream Half Bridge Driver Chips: First Increase Efficiency and then Reduce Cost
Electronic enthusiast network reported (Wen / Li Ningyuan) in DC motors, the voltage and current provided by single chip microcomputer are generally not enough to drive DC motors, and can only be used as driving signals. Therefore, a motor driver should be added between them, that is, the driver. The function of half bridge driver is to generate AC trigger signal through power tube, so as to generate large current to further drive the motor. Compared with the full bridge, the cost of the half bridge drive circuit is lower and the circuit is easier to form, while the cost of the full bridge circuit is high and the circuit is relatively complex. Of course, the full bridge circuit is not easy to produce leakage, while the half bridge circuit is easy to deteriorate the waveform and produce interference between oscillation and conversion.The dead band setting is generally added to the half bridge drive circuit. If the dead band is not added, the other electronic device will be fully opened before one power electronic device is completely closed, which will form a short circuit and burn the device. Therefore, how to reduce the dead time requirement in half bridge drive chip is a key point to reflect the performance.In fact, the performance of this type of chip from mainstream manufacturers is very high. The products with unique technology can be said to have their own advantages. When the efficiency can not open an obvious gap, reducing the cost and improving the cost performance have become another focus of the competition of mainstream half axle drive chips.Infineon half axle driver chipInfineon can be said to be an integrator in half axle drive. Their half axle drive chip usually has two interlocking channels. I will not repeat the familiar half axle drive IR2104 here. Everyone is too familiar with it.Let's take a look at the latest 650 V half bridge drive, a silicon on insulator (SOI) gate driver IC with high current (2.5 A) and low current (0.7 a) options, with excellent strength and immunity.First, let's talk about Infineon's unique skill, silicon on insulator (SOI) technology. The technology is essentially a high-voltage level conversion technology, which integrates BSD, and each transistor is separated by embedded silica. This technology is reflected in the chip's strong ability to resist negative transient voltage and low-level conversion loss.2ed2101s06f is a half bridge gate driver based on this technology. The series has 0.29 a pull current and 0.7 a fill current on the high side and low side grid drives. SOI brings the device the ability to resist negative transient voltage of 100V, which is absolutely leading in the industry. At the same time, because there is no parasitic thyristor structure in the device, locking will not occur under all temperature and voltage conditions.The delay of the device is slightly worse, 90ns, but this does not affect the extremely high durability and noise resistance brought by excellent negative transient voltage, and the extremely excellent performance of reducing 50% level conversion loss brought by SOI technology. In addition, integrated BSD has great advantages in saving space and reducing BOM cost.St half axle driver chipSt motor drives also cover a wide range, from single bridge to half bridge to multi-channel drives. In high-voltage applications, ST's half axle drive advantage will be more obvious than its peers, one of the main reasons is the exclusive BCD "offline" technology.(L6384E,ST)L6384e in the figure above is a high-voltage half bridge driver under St, that is, BCD "offline" technology is adopted. Through this technology, the l6384e high side floating part can work under the voltage rail of up to 600 v. the two device outputs can receive 650 Ma and 400 Ma respectively. However, due to the single input configuration, only one output will drive the high voltage. The dead time function further prevents cross conduction between the two outputs and can be adjusted by an external resistor connected to the DT / SD pin.In terms of performance index, in addition to 650 Ma and 400 Ma driving capacity, l6384e can provide DV / dt immunity of ± 50 V / NS in the full temperature range. Under 1NF load, the delay of the switch in rise stage is only 50ns and that in fall stage is only 30ns. At the same time, UVLO protection and VCC voltage clamp technology also give the device sufficient reliability.The l6384e ensures the matching delay between the low-voltage side and the high-voltage side, thereby simplifying the high-frequency operation of the equipment. Logic input is compatible with CMOS and easy to interface with control equipment.Similarly, BSD is also integrated in the device, which not only improves the efficiency, but also makes the design more compact.Ti half axle driver chipTi's high-voltage series is not selected here. Let's take a look at ti's low-voltage half bridge grid driver. The performance of TI's low-voltage series is stable enough and the system is reliable enough. Ti does not integrate BSD in low-voltage applications. After all, it is not a high-voltage application, but in terms of efficiency improvement, Ti brings the efficiency closer by reducing the dead time.Half bridge drivers are generally divided into low voltage and high voltage according to the bus voltage. Half bridge drivers lower than 120V have faster propagation delay, which can achieve faster switching and improve the overall system efficiency.Ucc27282120v half bridge grid driver is one of the most important products of Ti in applications lower than 120V half bridge drive. Ucc27282 is an n-channel MOSFET Driver. Through this device, two n-channel MOSFETs can be controlled in a topology based on half bridge or synchronous buck configuration. This series has a very outstanding capability because ucc27282 has a peak perfusion current of 3.5A, a peak pull current of 2.5A and low pull-up and pull-down resistance. Therefore, during MOSFET Miller platform conversion, the device can drive high-power MOSFET with minimum switching loss.In order to ensure the stability and flexibility of the device, ucc27282 is configured with many functions. The input pin and HS pin can withstand large negative voltage. The input pin is - 5V and HS pin is - 14V, so the system stability is improved. The input interlock further improves the robustness and system reliability in high noise applications. In high frequency applications, 5V UVLO allows extreme operating conditions and improves efficiency.In terms of dead time setting, ucc27282's small 16ns propagation delay and 1ns matching delay can minimize the dead time requirements, which is the technical key of Ti in improving efficiency.SummaryIn terms of half axle drive, these three companies have almost overwhelming advantages in the industry. These major manufacturers have their own unique technologies to reduce level conversion loss and dead time, so as to improve efficiency. At the same time, integrating BSD to reduce cost and save space has gradually become an industry trend, especially in the field of high-voltage applications. After all, cost performance is highly valued by users.Statement: This article is original by electronic enthusiasts. Please indicate the above source for reprint. If you need to join the group, please add wechat elecfans999. If you need to contribute and disclose your interview needs, please send it to email 。Editing: JQ
Three Reasons for Apple to Give Up Intel Chips
Apple released three new Macs on Tuesday, namely the MacBook Air, the 13 inch macbook pro and the Mac Mini. They look basically the same as the previous generation.The main update is chips: these new products replace Intel processors with M1 chips independently developed by apple. Tuesday's press conference marks that Apple laptops and desktops will give up Intel processors that have been used for 15 years, which will also be a major change in the semiconductor industry.According to market research firm Gartner, apple is the world's fourth largest PC manufacturer in terms of shipments. Therefore, Apple's decision to adopt self-developed chips in laptops and desktops will hit Intel.Intel said in a statement: "we believe that PCs using Intel Technology (such as PCs based on the 11th generation Intel Core mobile processor) will provide the best experience in the areas most valued by customers around the world and provide the most open platform for developers."Apple's chip is based on ARM technology instead of the x86 architecture of Intel chip. Arm was originally designed for mobile devices. The chips developed using ARM architecture always have higher efficiency, so they can prolong the battery life. On laptops, this may mean that you can add a few hours without using an external power supply.But this is only one of the reasons why Apple gave up Intel chips. The following summarizes the three reasons for Apple's move:1. Having core technology is an important strategy for appleTim Cook, Apple's CEO, often said that the company "takes owning and controlling the main technologies behind our products as a long-term strategy."For computer hardware companies, few technologies are more important than processors.Apple has invested heavily in the chip sector, including major acquisitions. The first was the acquisition of P.A. semi for us $278 million in 2008, which opened the development of the Department. Recently, it acquired part of Intel modem business for us $1 billion in 2019. Since 2010, the company's iPhone, iPad and apple watch have been using self-developed A-Series chips. Now, apple basically introduces the same technology into laptops and desktops, which means that all Apple computing devices basically run on the same framework.Wayne Lam, an analyst at CCS insight, said: "apple chips fully meet the company's overall control objectives. They currently control all elements in the computing field, from chips to software to the use of mice, so they are highly integrated."Controlling its own technology can help Apple integrate its products more deeply. This also means that it can operate according to its own plan - Johnny srouji, Apple's senior vice president, said last year that chip development takes three years - and can better control costs."Apple believes that they can innovate faster than the standard business model of Intel or Qualcomm, and then develop chips on this basis," LEM said.2. Intel's manufacturing capacity lags behindApple proudly said on Tuesday that the M1 chip of the new Mac uses 5 nm transistors.Gartner analyst Jon erensen said, "5 nm technology has a leading edge, and only a few products use this technology at present." Intel's products currently on sale use 10 nm transistors.Generally speaking, the more transistors a chip manufacturer can accommodate in the same space, the higher the efficiency of the chip. Intel currently only produces chips using 10 nm transistors.Intel will control its chip factories around the world, while Apple will hand over to Asian companies to manufacture its own chips. But Apple's chip manufacturing partner TSMC can produce 5-nanometer chips, but Intel can't."Intel has faced some challenges in manufacturing over the past few years. And I think these challenges have opened up a window or opportunity for arm based design to enter the market. Apple is one of the best ARM processor designers at present," said Gartner analyst Jon erensen.Intel CEO Bob Swan said earlier this year that the company was considering outsourcing manufacturing like apple."As Intel faces challenges in upgrading 10 nm and 7 nm, and contract manufacturers such as TSMC and Samsung increase efforts to promote such technologies, Intel has lost a major advantage and leveled the competitive environment to a certain extent," ellenson said.3. It can not only prolong the battery life, but also improve the performance, and even make the laptop work like a mobile phoneApple said that the M1 MAC is better than the old products, mainly because Apple claims that its independently developed chips have better performance and longer battery life than Intel chips.The new Mac will obviously extend its endurance. Apple's previous chips have been used in smartphones and tablets, which use much smaller batteries than laptops.At its press conference on Tuesday, apple stressed that it would evaluate the chip based on the performance per watt rather than the original performance.Apple said that when using the entry-level MacBook Air, it can browse the Internet for 15 hours on a single charge, nearly 30% longer than the 10 to 11 hours when using Intel chips.Apple said that the new Mac also works more like a mobile phone or tablet, with the function of waking up immediately from sleep. If developers take some measures to make it compatible with the app store, the new M1 Mac can even run iPhone applications.But analysts warned that these products need to be tested after they go on sale next week to confirm Apple's claimed performance.Patrick Moorhead, founder of moor insights, said: "the performance of the new M1 chip can hardly be evaluated because the company has not provided any detailed evidence for its claimed performance."
What If the Competition for Mobile Phone Chips Extends Beyond the Application Processor?
In the field of mobile phone chips, our eyes are focused on large chips (application processors, abbreviated as APU or AP). Due to the increasingly fierce competition and the withdrawal of people, there are only a few remaining application processor manufacturers. But now, the war has spread to chips other than application processors.After the merger of Chipworks, the TechInsights of research institutions enhanced the analysis of semiconductors. At the mobile conference of Linley group held today, techinsights put forward a view that the application processor is the winner. Through a set of charts, techinsights concluded that in a mobile phone, the supplier of the application processor is likely to obtain 25% to 45% of the share of all chips of the mobile phone.Techinsights disassembled a high-end model of Samsung Galaxy S7. Since Samsung replaced partalplayer to supply chips for Apple's iPod more than a decade ago, Samsung has begun to adopt the strategy of bundle sales to maximize its capacity advantages in memory (DRAM) and flash memory. In Galaxy S7, Samsung supplies more chips, such as fingerprint sensor, NFC chip, touch screen controller, and even many power management and RF front-end chips.Chip suppliers of mobile phones with Samsung processorsQualcomm is also sparing no effort to promote its RF technology. Qualcomm has focused on the field of millimeter wave RF front-end. Millimeter wave has excellent prospects in 5g, automotive electronics and other applications. Compared with Samsung, when a mobile phone adopts Qualcomm application processor, chip suppliers are more dispersed and other manufacturers have more opportunities. In the disassembled Samsung Galaxy S7 active, Qualcomm provides application processors, power management chips, audio chips and RF receiving chips.Status of chip suppliers for mobile phones with Qualcomm processorsMediaTek's chip price is lower, but the peripheral chips around the application processor are roughly the same as the above two. MediaTek's platform also needs chips such as DRAM, flash memory, MEMS sensor, RF power amplifier and microphone. In the disassembled Meizu Pro 6, MediaTek provides application processor, power management, RF receiving chip and WiFi chip.Chip suppliers of mobile phones using MediaTek processorsAlthough the samples of the above three cases are too small and the conclusions are only for reference, the above cases do show a possibility that the chip suppliers of medium and low-end mobile phones are more scattered and the competition is more intense. In order to enter Apple's supply chain, many suppliers have self restricted and did not adopt the bundling scheme. As more and more high-end mobile phone functions are adopted by low-end mobile phones, suppliers will fight to enter Chinese mobile phone manufacturers in the next few years.This indicates that more semiconductor mergers and acquisitions will take place in the near future, just like ADI's merger and acquisition of linear technology. RF, MEMS and touch screen interfaces are possible.
From 5g Mobile Phone Chips to AI Chips, TSMC Eats Huawei's New Chip Orders
Mobile phone mobile phone is one of the ten largest integrated circuit enterprises in Chinese mainland. TSMC is the leading enterprise in the world. The cooperation between the two companies started in 2000. With the rapid development of HUAWEI mobile phone in the past five years, the cooperation with TSMC has become more and more close. It is not only the mobile phone chip, including the AI chip, 5G modem chip and server chip field, but also has been developing rapidly in the past five years. Both sides have entered into comprehensive cooperation. Through cooperation with TSMC, Huawei has always been ahead of other companies in the world in 20nm, 16nm, 10nm and 7Nm process nodes, laying its image as an innovator in the mobile phone market. The following is the latest report of Taiwan business times. The scope of cooperation between the two sides is expanding driven by the Internet of things and AI technology.Although Huawei faces the dual operational pressure of the Sino US trade war and the investigation of the chief financial officer, it continues to accelerate the development of its own customized chips, and rush to release a number of new AI / HPC chips for data centers, high-speed networks, solid state drives (SSDs) and other artificial intelligence and high-performance computing (AI / HPC) before the end of the year. Huawei has made every effort to improve the chip self-sufficiency rate. In its big move, it adopts advanced processes such as 16 nm and 7 nm. TSMC, the leader of wafer foundry, will directly benefit from it. Next year, Huawei will take all Huawei wafer foundry orders, and Huawei also ranks as the second largest customer of TSMC.Although Huawei has recently been affected by the US China trade war, and many telecommunications bidding cases in Pro US countries prohibit Huawei from bidding, Huawei continues to expand its own chip research and development, and actively adopts the most advanced 16 nm and 7 nm processes of TSMC. For TSMC, Huawei will have a number of 7 nano chips for chip production next year, and is expected to become the first customer to adopt its support for extreme ultraviolet (EUV) lithography technology 7 nano and 5 nano.In recent years, Huawei has developed its own customized chips through reinvestment in Hisilicon, an IC design plant. In addition to product lines such as power management IC, digital home appliance microcontroller (MCU), base station and high-speed network processor, in order to cooperate with the shipment of smart phones, the new generation Kirin 980 Mobile phone chip using TSMC 7 nm has been mass produced and shipped, and 5g modem chip is ready for mass production.Huawei is optimistic about the huge business opportunities in AI related fields next year. Huawei also expands its layout through self-developed chips. Huawei recently announced the first data center processor hi1620 based on ARM architecture, which adopts TSMC 7-nm process and is expected to enter mass production next year. Huawei's new chip adds an armv8 architecture customized core with the R & D code name of Taishan, which can support 48 core or 64 core configuration, and will support the high-speed transmission of the new generation PCIe Gen 4. Huawei will also launch the world's first smart management chip hi1711 next year. It adopts TSMC's 16 nm process, adds AI management engine and smart management algorithm, and can carry out in-depth learning and machine learning by the server.Huawei's self-developed cloud computing AI chips, including ascend 310 using TSMC 12 nm and ascend 910 using TSMC 7 nm, are expected to be launched in the second quarter of next year. For Huawei, ascend series chips can assist in AI application layout, including training and reasoning in smart city, self driving, industry 4.0 and other applications.This article is from Taiwan business times. This article is reprinted and shared.
From Memory Chips, Analog Chips and Power Semiconductors, Watch Mu Exhibition Quickly!
On July 5, the three-day Munich Shanghai Electronics Exhibition ended successfully. Different from previous years, this year's international chip manufacturers decreased, which is estimated to be affected by the epidemic.Domestic semiconductor manufacturers participating in this year mainly include memory chip, analog chip and power device manufacturers, and these manufacturers have brought new technologies and emerging application progress such as 5g, automotive electronics, intelligent equipment and third-generation semiconductor materials.Memory chip manufacturerThe memory chip manufacturers participating in this exhibition include Zhaoyi innovation, Dongxin semiconductor, Juchen semiconductor, etc. electronics enthusiasts learned that at present, the application progress of Zhaoyi innovation and Dongxin semiconductor's NOR flash in 5g base station and automotive electronics is obvious.Zhaoyi innovationAt this exhibition, Zhaoyi innovation focused on three product lines and solutions of memory, MCU and sensor, covering multiple application fields such as industry, automobile, 5g and consumer electronics. Zhaoyi innovation is a leading nor flash supplier in China. Its nor flash products have entered the automotive market and have entered the customer test stage in terms of 5g base stations.Electronic enthusiast shootingAt the exhibition, Zhaoyi innovation showed a number of on-board digital combination instrument solutions using gd25spi nor flash. GD nor flash10.25-inch dual screen on-board virtual instrument is a large capacity and high data throughput storage solution based on 512Mbit SPI nor flash parallel connection of two gd25s513md.The picture is from the official account of the trillion easy innovations.During the same period of the exhibition, Zhaoyi innovation also announced the launch of gd25 / gd55b / T / X series, the first high-performance spinorflash with a capacity of up to 2GB in China. This series can provide different capacity options from 512MB to 2GB, support high-speed 4-channel and high-speed 8-channel compatible with jedecxspi and xccela specifications, and is mainly aimed at industrial, on-board AI, 5g and other related application fields.The picture is from the official account of the trillion easy innovations.Zhaoyi innovation said that the gd25 / 55B / T / X series products launched this time represent the highest level in the spinorflash industry, provide 512MB, 1GB and 2GB capacity options, use 3.3V and 1.8V power supply respectively, have a combination of up to 18 major models, and support a variety of packaging forms.Dongxin semiconductorAt this exhibition, the product lines displayed by Dongxin semiconductor include spinor, spinand, ppinand, DRAM and MCP series products, which can be applied to products in line with scientific and technological intelligent life, such as TWS headphones, shared bicycles, IPcamera, 10g-pon, WiFi 6, etc.Spinor for sharing bicycles and spinand for enterprise gateway (photographed by E-enthusiasts)Spinand for smart speakers and spinor for routersDongxin semiconductor is a fabless chip enterprise, focusing on the design, production and sales of small and medium-sized NAND and nor memory chips. It is a local memory chip R & D and design company that can provide NAND / nor / DRAM Design Process and product scheme at the same time in China.Chen Lei, deputy general manager of Dongxin semiconductor, said in an interview with electronics enthusiasts, "the company's NOR flash products have entered the supply chain of China's leading 5g base station suppliers."Juchen semiconductorJuchen semiconductor is a high-tech analog / digital chip design company with more than 20 years of experience. Its main business is the R & D, design and sales of integrated circuit products, and provides application solutions and technical support services. At present, it has three main product lines: EEPROM, voice coil motor drive chip and smart card chip.According to the latest data of research institutions, Juchen semiconductor ranked third in the world and first in China in 2019. It is the mainstream EEPROM supplier of memory in subdivided fields such as smartphone camera module and LCD module.At this exhibition, Juchen semiconductor demonstrated the automotive Serial EEPROM memory.Juchen semiconductor said that with the continuous warming of ADAS concepts such as automobile assisted driving, informatization and intelligence, the automotive electronics market has ushered in unprecedented development opportunities.Juchen automotive EEPROM has the advantages of high durability, high reliability, strong temperature adaptability and strong anti-interference ability. It can be used to store configuration and calibration data to meet a wider range of driving functions. The target is applied to modules such as body control module, driving assistance system and infotainment and Internet of vehicles system.Electronic enthusiast shootingAnalog chip manufacturerThe analog chip manufacturers participating in this exhibition mainly include Guangxin electronics, sirip, Saiwei electronics, etc. the power chip products in analog chips are also the most concerned parts. This exhibition will show the progress of manufacturers in the field of power chips.Wide core electronicsAt this exhibition, Guangxin electronics exhibited products including switch, power management, LED driver, level shifter, amplifiers and home appliance.Electronic enthusiast shootingGuangxin Electronic Technology (Shanghai) Co., Ltd. is an integrated circuit chip design company founded in Shanghai by the Chinese entrepreneurial team in Silicon Valley at the end of 2007. The company focuses on the design, R & D and sales of high-performance analog and mixed signal integrated circuit chip products. Its products are widely used in mobile phones, tablets, wearable devices, POS machines, GPS, computers, LCD TVs Internet of things, Nb / WiFi / Bluetooth and other modules, smart home, small household appliances and other general consumer electronic products, as well as communication, industrial control and other fields.Since its establishment, the company has successfully developed more than ten series and hundreds of models of products.The staff of Guangxin electronics at the exhibition site said, "the Mipi switch products exhibited by Guangxin this time, such as bct642, bct644 and bct646, are applied in the cameras of almost all brand mobile phones on the market."Electronic enthusiast shootingSiripThreep (3peak) mainly focuses on the design of high-performance analog chips. It has accumulated a large number of technical reserves in the field of signal chain analog chips and power management analog chips, and continued to develop and upgrade to achieve large-scale mass production of analog chip products.The products are widely used in domestic and foreign brand customers, covering a variety of application fields such as information and communication, industrial control, monitoring safety, medical health, instruments and household appliances.The staff of srip at the exhibition site told the electronics enthusiasts, "in the early stage, the company mainly focused on the signal chain analog chip, began to develop power products in 2017, and began to ship a large number of products in 2018. Among them, power monitoring products began to ship in 2017. At present, Haikang, Dahua and other manufacturers use the company's power monitoring products."Srip's power management products on display this time mainly include linear regulated power supply, switching power supply, charging management, power monitoring and reset chip, power timing control, motor drive, etc.Electronic enthusiast shootingPico electronSaiwei Electronics Co., Ltd. is a power supply and battery management chip fabless semiconductor company. Its product line includes battery meter chip, battery management chip, battery protection chip, BMS front-end acquisition chip and USB charging control chip.The company mainly focuses on market areas, including mobile communications, tablet computers, notebook computers, electric tools, electric vehicles, battery energy storage equipment and many other fields.In this exhibition, the power chip products displayed by saimicroelectronics include electricity meter, battery protection IC, USB port charging and protection, power management, etc. Electricity meter products are mainly used in mobile phones, TWS headphones, tablets and POS machines; Battery protection IC is mainly used in electric tools, electric bicycles, twist cars and vacuum cleaners;USB port charging and protection products are mainly used in mobile power supply, car charging, travel charging, wall charging, row and plug, etc; Power management products are mainly used in smart watches, smart bracelets, TWS headphones, smart bracelets, IOT devices, etc.Electronic enthusiast shootingPower semiconductor manufacturerIn recent years, the development of the third generation semiconductor materials has gradually matured, and the products have been gradually applied in various fields. At this exhibition, power semiconductor manufacturers such as China Resources micro, Tyco Tianrun and Ruineng semiconductor have launched new products and displayed application cases.Hua runweiChina Resources micro is a semiconductor enterprise mainly operating in IDM mode. It has four business groups and five business strategic portfolios. In the power device segment, China Resources Microelectronics is displayed in the form of high-voltage and low-voltage MOSFET and IGBT product lines. The high-voltage product line focuses on 600v-700 high-voltage superjunction products, the low-voltage product line shows 85-135v series of low-voltage trench platform and 30V series of low-voltage trench second-generation platform, and IGBT shows a series of products with 600V and 1200vtrenchfs structure.Electronic enthusiast shootingDuring the same period of the exhibition, China Resources Microelectronics held a new SiC product launch, officially invested 1200V and 650V industrial SiC Schottky diode power device product series into the market, and announced the formal mass production of China's first 6-inch commercial SiC wafer production line. It is reported that China Resources micro's full range of 1200V / 650vsic diode products are widely used in solar energy, UPS, charging pile, energy storage and vehicle power supply.Pictures from Huarun microelectronics official accountTyco TianrunIn this exhibition, Tyco Tianrun not only displayed excellent semiconductor device series products, but also focused on solutions in the direction of adapter, medical power supply, mining machine power supply, AD / DC power supply and PFC. These solutions all adopted the power semiconductor devices of Tyco Tianrun's third-generation semiconductor materials.The official account is from Tyco Tianrun semiconductor.Tyco Tianrun said that due to the use of power devices made of third-generation semiconductor materials, the working frequency of the whole machine is improved and the volume of inductance and other components is significantly reduced, so as to improve the power density and efficiency of the whole machine.Ruineng semiconductorRuineng semiconductor comes from NXP standard products division. The company has earlier launched the power devices of the third generation semiconductor materials. The product portfolio of power semiconductors includes silicon carbide diodes, silicon controlled rectifiers, three terminal bidirectional thyristors, power diodes, high-voltage transistors, etc. Products are widely used in telecommunications, computers, consumer electronics, smart appliances, lighting, automotive and power management applications.Electronic enthusiast shootingRuineng said that the PT doped fast recovery diode has optimized efficiency and EMI characteristics; 1200vscr with planar process has high junction temperature of 150 ℃ and good impact resistance.The exhibition also showed passive components, components e-commerce platforms, connectors, etc., which will not be introduced one by one here.SummaryAffected by the epidemic, not only the delay of the exhibition, but also the performance of many semiconductor manufacturers in the first half of this year. However, the epidemic has also brought new market opportunities to some manufacturers. In the second half of this year, the market situation was still unstable. Industry insiders believe that this also gives manufacturers more time and energy to invest in R & D.In the long run, the Sino US friction and the epidemic also provide more display space and stage for domestic semiconductor manufacturers. At the same time, the gradual maturity of emerging fields such as 5g, artificial intelligence and the Internet of things will accelerate the development of domestic semiconductor industry.This article is original by the electronic enthusiast network. It is prohibited to reprint without authorization. To reprint, please add the micro signal elecfans999
Xilinx Series Chips Support the Hardware Accelerator Board of Survey Computer Company
At the supercomputer Conference (SC 14) held by New Orleans, converse computer introduced a lot about the standard extension of HLL (high-level language) and the application of acceleration using FPGA. Convey company has manufactured a complete set of FPGA based hardware accelerator cards, which support PCIe computing interface and server system package Wolverine ("Wolverine"), and these designs are based on Xilinx virtex-7 series FPGA chips. Covey company is one of several providers that can provide commercial finished products of accelerator board. Accelerator board is also a part of sdaccel development environment launched by Xilinx company. (create a software development environment similar to CPU / GPU for OpenCL, C and C )The FPGA based accelerator application Wolverine ("Wolverine") supports PCIe systemAt the SC14 conference, the booth of Covey company used the form of information poster to provide a lot of information about using high-level language (HLL) to accelerate the development of FPGA based application code. Now I will quote the key part of the poster in case you miss the booth of Covey company or can't come to New Orleans to attend SC14 meeting in person:In the past, accelerator application design mainly used hardware description language (HDL) such as Verilog for programming. This requires special skills and tool software, which limits the device from being accessible to more people.Recently, the accelerator programming standard has been launched to support the design of portable applications. This standard mainly faces accelerators from different providers. Here we introduce the OpenMP compiler prototype developed by convey computer and the OpenCL compiler developed by Xilinx (that is, the sdaccel development tool software launched by Xilinx)FPGA is a programmable integrated circuit. Different circuit designs can be realized through programming. These designs are realized through hardware description language (HDL) such as Verilog. The hardware description language code is converted into bitstream file through hardware synthesis tool, which is downloaded to the device to complete the configuration of the circuit.The OpenMP compiler of Covey company adopts OpenMP 4.0 accelerator instructions and converts them into the company's hybrid thread (HT) to represent them. The intermediate language includes the combination of high-level programming instructions based on C and real-time runtime, mainly to access the underlying devices of the system. This toolset transforms HT into Verilog language. Many tasks are completed automatically, including creating reusable parallel units and transforming work sequence tables. The generated Verilog language code and the system bottom driver code provided by the hardware platform will be integrated to generate a bitstream file. Finally, the bitstream file will be downloaded to the processor to complete the configuration.The sdaccel development software of Xilinx company can compile the OpenCL application code into binary files, which can be recognized and executed by the processor. The compilation process adopts the standard programming development environment. The following illustration shows how these two compilers work:Using advanced programming tools will require less code to realize the description of functions, which allows programmers to focus more on the research of algorithms rather than bother to build some underlying drivers.For example, the manually implemented graph500 breadth first search kernel uses Verilog language, which probably includes more than 4500 lines of code. The same kernel implementation uses mixed thread (HT) intermediate transition language, which only needs 883 lines of code. The kernel using opnemp version only needs 304 lines of C language code. The kernel performance using OpenMP is 9.7 gteps, the kernel performance using Verilog language is 11.4gteps, and the kernel performance using HT language is 11.2gteps, which is acceptable in comparison.From the significance shown in this example, the simple kernel performance implemented with OpenMP code can completely match the kernel performance implemented with Verilog language. For example, graph500, the version implemented with OpenMP can reach 85% of the version performance implemented with Verilog language, but only requires less code.This introduction to the extension of high-level language standard allows the program design of accelerator application based on FPGA to be greatly simplified. The programming tools based on these standards can generate highly parallel hardware designs, and the performance can be compared with the design performance realized by the underlying hardware description language.---> END
The Price of TSMC Chips, the World's First Foundry, Rose in Disguise
Recently, the world has fallen into a "chip shortage", and the phenomenon of short supply is very serious. According to industry sources, the whole electronic industry is now facing the problem of parts shortage.Affected by this, the global chip industry has set off a wave of price rise. A number of IC Design plants and IDM plants have said that they will raise prices in 2021.Nowadays, the global semiconductor material prices, wafer prices, package test prices, chip prices and so on, are a headache.In recent days, TSMC, the world's first wafer foundry, will also raise prices in a disguised form, and American enterprises will bear the brunt.Chip giants such as apple, AMD and NVIDIA are major customers of TSMC's 12 inch wafers. TSMC will offer these major customers a 3% discount on 12 inch wafers.According to foreign media, TSMC has recently cancelled this discount policy. As a result, American enterprises will be affected, and even apple, TSMC's largest customer, cannot escape.TSMC is a world leader in advanced processes such as 7Nm and 5nm. TSMC occupies nearly 51% of the global wafer foundry market. TSMC, which has formed a monopoly advantage, naturally has the confidence to raise prices.Therefore, the founder of moorinsights & strategy, a technology consulting firm, said that we also need another high-tech Wafer Factory besides TSMC.This year, TSMC's process capacity from 7Nm to 55nm has been in full load, and this trend will continue in 2021.Not only TSMC, Samsung Electronics and other wafer foundry, have raised the quotation of 8-inch wafer foundry. It is speculated that the price increase will be at least 20% or even 40% in 2021.Why is the world in a shortage of chips? A novel coronavirus pneumonia is a major factor that affects the production of chips.At the same time, the global consumer enthusiasm has warmed up. Coupled with the development of 5g, IOT and AI, the demand for PC, game console and smart phone has increased, and the demand for chips has increased greatly.In addition, the United States arbitrarily modified the chip rules, which also triggered a chip crisis.Yu Chengdong once said that American companies and Chinese companies are inseparable from each other. They are interdependent under globalization. If they resist, it will do great harm to both sides.Today, Yu Chengdong's judgment is being verified little by little. The frequent sanctions imposed by the United States on other countries have damaged the global industrial chain and eventually spread to American enterprises.American companies were the first to be affected by TSMC's 8-inch price rise.Moreover, under the hegemonic act of the United States, China has overweight the semiconductor industry and the chip industry has entered the fast lane; At the same time, the 17 EU countries also work together to make cores, unwilling to fall behind the United States.
What Are the Performance Improvements Compared with Bare Chips of Apple A12z and A12x Processors?
On April 14, Apple launched the latest generation of iPad Pro tablet last month, which surprised many people. Instead of carrying the high-end version of Apple's latest A13 SOC, apple used a SoC called a12z, which obviously shows that it is based on the same vortex / tempest architecture as the previous a12x, that is, the processor of 2018 iPad pro. Apple's unusual move makes people suspect that a12z may not be a new chip at all, but is essentially a12x. Today's techinsights report confirmed this speculation.1、 A12z processor squeezing toothpasteThe technical analysis and reverse engineering company released a note in a short tweet, announcing their research results and attaching a comparison photo of die shots of a12z and a12x. In short, the two chips seem to be exactly the same. The position and size of each function block on the a12z are exactly the same as those of the a12x. The a12z only turns on the eighth GPU core not turned on by the a12x.Although the chip screenshot analysis of techinsights does not sort out some more subtle details, such as the stepping of the chip - whether the a12z adopts a newer step, a12z does not bring anything new in terms of the chip.On the contrary, the significant change between the two chips lies in their configuration: only 7 GPU clusters are enabled for a12x when shipping, while all 8 GPU clusters are enabled for a12z when shipping. Although this is only a small change, it makes sense for apple to enable the 8th cluster for higher performance. A12x is produced on TSMC's 7Nm production line. When it is released in 2018, a12x is one of the largest 7Nm chips. It should have a higher yield in 18 months, so it can open the eighth GPU core.2、 The running score data is not different from the previous generation of productsThe second day after the release of iPad Pro 2020, its rabbit run data flowed out, confirming the above statement. As can be seen from the running score data, the iPad Pro 2020 has a running score of 712218, which is not much different from the 705585 of the next generation iPad Pro 2018. That's it? Did the apple start squeezing toothpaste? It is true, but it also proves that Apple squeezed too much toothpaste when developing a12x. In fact, even two years after its release, a12x is still the most powerful mobile processor, and even A13 can't catch up with it. On the premise of ensuring advanced performance, Apple will focus on GPU and power consumption control to further improve the use experience of iPad pro.Incidentally, it is also disclosed in the running score data of ANN rabbit that the full series of iPad Pro 2020 will be equipped with 6GB running memory. In contrast, only the 1TB top configuration version of the previous generation iPad Pro was equipped with 6GB storage, and the other versions were only 4GB storage. IPad Pro's little buddy knows that iPad's background operation is awesome. 4GB can ensure that a large number of APP will run without killing the background. Now it has been upgraded to 6GB, and the experience needs to be upgraded. The quantity is increased and the price is reduced. The iPad Pro is really delicious this time.3、 A13 chip may be launched on iPhoneAs for why Apple will choose to reuse a12x instead of debugging a13x on the iPad pro in 2020, it should be attributed to the cost factor, because the tablet market is very different from the smartphone market. In terms of high-performance arm tablets, apple is almost unmatched. Even so, the number of iPads they sell has always been unmatched compared with the iPhone. Therefore, there are fewer devices to compete with, and the chip development cost continues to rise with the upgrading of each generation of lithography technology. In short, there is no point in creating new chip designs for midrange products every year at some point.This article is a comprehensive report by electronic enthusiasts. The content is from it home. Please indicate the above source for reprint.
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